View X3C04L1-05S_7310381.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c hybrid coupler 3 db, 90 description the x3c21p103s is a low profile, high performance 3db hybrid coupler in a new easy to use, manufacturing friendly surface m ount package. it is designed for lte and wimax band applications. the x 3c21p103s is designed particularly for balanced power and low no ise amplifiers, plus signal distribution and other applications where lo w insertion loss and tight amplitude and phase balance is required. it can be used in high power applications up to 110 watts. parts have been subjected to rigorous qualification testing and they are manufactured using materials with coefficients of t hermal expansion (cte) compatible with common substrates such as fr4, g10 , rf35, ro4003 and polyimide. produced with 6 of 6 rohs compliant tin immersion finish. electrical specifications ** frequency isolation insertion loss vswr amplitude balance mhz db min db max max : 1 db max 20002300 23 0.22 1.15 0.22 21102170 25 0.12 1.12 0.10 23002400 18 0.25 1.33 0.40 18002200 23 0.17 1.17 0.22 phase power ? jc operating temp. degrees avg. cw watts oc/watt oc 90 4.0 90 32.1 55 to +95 90 2.0 110 32.1 55 to +95 90 4.0 90 32.1 55 to +95 eatures: ? 1800-2300 mhz ? lte, wimax ? high power ? very low loss ? tight amplitude balance ? high isolation ? production friendly ? tape and reel ? lead-free 90 3.0 90 32.1 55 to +95 **specification based on performance of unit proper ly installed on anaren test board 541470001 with small signal applied. specifications subject to change w ithout notice. refer to parameter definitions for details. mechanical outline
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c hybrid coupler pin configuration the x3c21p103s has an orientation marker to denote pin 1. once port one has been identified the othe r ports are known automatically. please see the chart below fo r clarification: configuration pin 1 pin 2 pin 3 pin 4 splitter input isolated 3db 90 ? 3db splitter isolated input 3db 3db 90 ? splitter 3db 90 ? 3db input isolated splitter 3db 3db 90 ? isolated input *combiner a 90 ? a isolated output *combiner a a 90 ? output isolated *combiner isolated output a 90 ? a *combiner output isolated a a 90 ? *notes: a is the amplitude of the applied signals . when two quadrature signals with equal amplitudes are applied to the coupler as described in the table, t hey will combine at the output port. if the amplitu des are not equal, some of the applied energy will be direc ted to the isolated port. the actual phase, , or amplitude at a given frequency for all ports, can be seen in our deembedded s parameters, that can be downloaded at www.anaren.co m .
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c insertion loss and power derating curves typical insertion loss derating curve for x3c21p103 0.3 0.25 0.2 0.15 0.1 0.05 0 100 0 100 200 300 400 temperature of the part ( o c) in sertion l oss (db ) typical insertion loss (f=2170mhz) typical insertion loss (f=2300mhz) typical insertion loss (f=2400mhz) typical insertion loss (f=2200mhz) x3c21p1-03 power derating curve 0 20 40 60 80 100 120 140 160 180 200 0 50 100 150 200 mounting interface temperature ( o c) t o t a l in p u t p o w e r ( w a t t s ) 2110 2170mhz 2000 2400mhz 95 110 90 insertion loss derating: the insertion loss, at a given frequency, of a grou p of couplers is measured at 25 c and then averaged. the measurements are performed under small signal conditions (i.e. using a vector network analyzer). the process is repeated at 85 c, 150 c, and 200 c. a best fit line for the measured data is computed and then plotted from 55 c to 300 c. power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mou nting surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insertion loss. the therm al insertion loss is defined in the power handling sec tion of the data sheet. as the mounting interface temperature approaches th e maximum continuous operating temperature, the power handling decreases to zero. if mounting temperature is greater than 95 c, xinger coupler will perform reliably as long as the input power is derated to the curve above.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c typical performance (-55c, 25c & 95c): 1700-240 0 mhz
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c typical performance (-55c, 25c & 95c): 1700-240 0 mhz
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c definition of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 system. a vswr of 1:1 is optimal. vswr = min max v v vmax = voltage maxima of a standing wave vmin = voltage minima of a standing wave return loss the impedance match of the coupler to a 50 system. return loss is an alternate means to express vswr. return loss (db)= 20log 1 vswr 1 vswr + insertion loss the input power divided by the sum of the power at the two output ports. insertion loss(db)= 10log direct cpl in p p p + isolation the input power divided by the power at the isolated port. isolation(db)= 10log iso in p p phase balance the difference in phase angle between the two output ports. phase at coupled port C phase at direct port amplitude balance the power at each output divided by the average power of the two outputs. 10log ?? ? ?? ? + 2 p p p direct cpl cpl and 10log ?? ? ?? ? + 2 p p p direct cpl direct
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c notes on rf testing and circuit layout the x3c21p103s surface mount couplers require the use of a test fixture for verification of rf perfor mance. this test fixture is designed to evaluate the coupler in the same environment that is recommended for insta llation. enclosed inside the test fixture, is a circuit boar d that is fabricated using the recommended footprin t. the part being tested is placed into the test fixture and pressure is applied to the top of the device using a pneuma tic piston. a four port vector network analyzer is connected to the fi xture and is used to measure the sparameters of th e part. worst case values for each parameter are found and compar ed to the specification. these worst case values ar e reported to the test equipment operator along with a pass or fa il flag. see the illustrations below. 3 db and 5db test board test board in fixture test station
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c the effects of the test fixture on the measured dat a must be minimized in order to accurately determin e the performance of the device under test. if the line i mpedance is anything other than 50 and/or there is a discontinuity at the microstrip to sma interface, there will be e rrors in the data for the device under test. the te st environment can never be perfect, but the procedure used to build and evaluate the test boards (outlined below) demo nstrates an attempt to minimize the errors associated with test ing these devices. the lower the signal level that is being measured, the more impact the fixture errors will h ave on the data. parameters such as return loss and isolation/directivity, which are specified as low a s 27db and typically measure at much lower levels, will present the greatest measurement challenge. the test fixture errors introduce an uncertainty to the measured data. fixture errors can make the per formance of the device under test look better or worse than it actu ally is. for example, if a device has a known retur n loss of 30db and a discontinuity with a magnitude of C35db is introd uced into the measurement path, the new measured re turn loss data could read anywhere between C26db and C37db. t his same discontinuity could introduce an insertion phase error of up to 1 . there are different techniques used throughout the industry to minimize the affects of the test fixtur e on the measurement data. anaren uses the following design and deembedding criteria: ? test boards have been designed and parameters spec ified to provide trace impedances of 50 1 . furthermore, discontinuities at the sma to micros trip interface are required to be less than C35db and insertion phase errors (due to difference s in the connector interface discontinuities and the electrical line length) should be less than 0.50 from the median value of the four paths. ? a thru circuit board is built. this is a two por t, microstrip board that uses the same sma to microstrip interface and has the same total length (insertion phase) as the actual test board. the thru board must meet the same stringent requireme nts as the test board. the insertion loss and insertion phase of the thru board are measure d and stored. this data is used to completely deembed the device under test from the test fixture. the deembedded data is available in sparameter form on the anaren website (www.anaren.com). note : the sparameter files that are available on the anaren.com website include data for frequencies tha t are outside of the specified band. it is important to n ote that the test fixture is designed for optimum p erformance through 2.3ghz. some degradation in the test fixture perfor mance will occur above this frequency and connector interface discontinuities of C25db or more can be expected. t his larger discontinuity will affect the data at fr equencies above 2.3ghz. circuit board layout the dimensions for the anaren test board are shown below. the test board is printed on rogers ro4003 m aterial that is 0.032 thick. consider the case when a different material is used . first, the pad size must remain the same to accommodate the part. but, if the material thicknes s or dielectric constant (or both) changes, the rea ctance at the interface to the coupler will also change. second, the linewidth required for 50 will be different and this will introduce a step in the line at the pad where the coupler int erfaces with the printed microstrip trace. both of these conditions will affect the performance of the part. to achieve the specified performance, serious atten tion must be given to the design and layout of the circuit environment in whi ch this component will be used. if a different circuit board material is used, an a ttempt should be made to achieve the same interface pad reactance that is present on the anaren ro4003 test board. wh en thinner circuit board material is used, the grou nd plane will be closer to the pad yielding more capacitance for the same size interface pad. the same is true if th e dielectric constant of the circuit board material is higher th an is used on the anaren test board. in both of the se cases, narrowing the line before the interface pad will in troduce a series inductance, which, when properly t uned, will compensate for the extra capacitive reactance. if a thicker circuit board or one with a lower dielectr ic constant is used,
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c the interface pad will have less capacitive reactan ce than the anaren test board. in this case, a wide r section of line before the interface pad (or a larger interface pad ) will introduce a shunt capacitance and when prope rly tuned will match the performance of the anaren test board. notice that the board layout for the 3db and 5db co uplers is different from that of the 10db and 20db couplers. the test board for the 3db and 5db couplers has all fou r traces interfacing with the coupler at the same a ngle. the test board for the 10db and 20db couplers has two traces approaching at one angle and the other two traces at a different angle. the entry angle of the traces has a significant imp act on the rf performance and these parts have been optimized for the layout used on the test boar ds shown below. 3 db and 5db test board testing sample parts supplied on anaren test boards if you have received a coupler installed on an anar en produced microstrip test board, please remember to remove the loss of the test board from the measured data. the loss is small enough that it is not of concern for return loss and isolation/directivity, but it should certainly be c onsidered when measuring coupling and calculating t he insertion loss of the coupler. an sparameter file for a thru bo ard (see description of thru board above) will be supplied upon request. as a first order approximation, one should consider the following loss estimates: frequency band avg. ins. loss of test board @ 25 c 869-894 mhz ~0.064db 925-960 mhz ~0.068db 1805-1880 mhz ~0.119db 1930-1990 mhz ~0.126db 2110-2170 mhz ~0.136db the loss estimates in the table above come from roo m temperature measurements. it is important to note that the loss of the test board will change with temperature . this fact must be considered if the coupler is to be evaluated at other temperatures.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c peak power handling highpot testing of these couplers during the quali fication procedure resulted in a minimum breakdown voltage of 1.31kv (minimum recorded value). this voltage level corresponds to a breakdown resistance capable of h andling at least 12db peaks over average power levels, for ver y short durations. the breakdown location consisten tly occurred across the air interface at the coupler contact pad s (see illustration below). the breakdown levels at these points will be affected by any contamination in the gap area ar ound these pads. these areas must be kept clean for optimum performance. it is recommended that the user test f or voltage breakdown under the maximum operating co nditions and over worst case modulation induced power peakin g. this evaluation should also include extreme envi ronmental conditions (such as high humidity). orientation marker a printed circular feature appears on the top surfa ce of the coupler to designate pin 1. this orientat ion marker is not intended to limit the use of the symmetry that thes e couplers exhibit but rather to facilitate consist ent placement of these parts into the tape and reel package. this en sures that the components are always delivered with the same orientation. refer to the table on page 2 of the da ta sheet for allowable pin configurations. test plan xinger iii couplers are manufactured in large panel s and then separated. all parts are rf small signal tested and dc tested for shorts/opens at room temperature in the fixture described above . (see qualification flow chart section for details on the accelerated life test procedures .)
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c power handling the average power handling (total input power) of a xinger coupler is a function of: ? internal circuit temperature. ? unit mounting interface temperature. ? unit thermal resistance ? power dissipated within the unit. all thermal calculations are based on the following assumptions: ? the unit has reached a steady state operating cond ition. ? maximum mounting interface temperature is 95 o c. ? conduction heat transfer through the mounting inte rface. ? no convection heat transfer. ? no radiation heat transfer. ? the material properties are constant over the oper ating temperature range. finite element simulations are made for each unit. the simulation results are used to calculate the u nit thermal resistance. the finite element simulation requires the following inputs: ? unit material stackup. ? material properties. ? circuit geometry. ? mounting interface temperature. ? thermal load (dissipated power). the classical definition for dissipated power is te mperature delta ( t) divided by thermal resistance (r). the dissipated power (p dis ) can also be calculated as a function of the total input power (p in ) and the thermal insertion loss (il therm ): ) ( 10 1 10 w p r t p therm il in dis ? ?? ? ? ?? ? ? ? = = ? (1) power flow and nomenclature for an x style couple r is shown in figure 1.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c pin 1 pin 4 input port coupled port direct port isolated port p in p out (rl) p out (iso) p out (cpl) p out (dc) figure 1 the coupler is excited at the input port with p in (watts) of power. assuming the coupler is not ide al, and that there are no radiation losses, power will exit the coupler at all four ports. symbolically written, p out(rl) is the power that is returned to the source because of impedance mismatc h, p out(iso) is the power at the isolated port, p out(cpl) is the power at the coupled port, and p out(dc) is the power at the direct port. at anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and direct ports: note: in this document, insertion loss is taken to be a positive number. in many places, insertion lo ss is written as a negative number. obviously, a mere sign change equ ates the two quantities. ) db ( p p p log 10 il ) dc ( out ) cpl ( out in 10 ? ?? ? ? ?? ? + ? = (2) in terms of sparameters, il can be computed as fol lows: ) db ( s s log 10 il 2 41 2 31 10 ?? ? ?? ? + ? ? = (3) we notice that this insertion loss value includes t he power lost because of return loss as well as pow er lost to the isolated port. for thermal calculations, we are only interested in the power lost inside the coupler. since p out(rl) is lost in the source termination and p out(iso) is lost in an external termination, they are not b e included in the insertion loss for thermal calculations. therefore, we define a new i nsertion loss value solely to be used for thermal c alculations:
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c ) ( log 10 ) ( ) ( ) ( ) ( 10 db p p p p p il rl out iso out dc out cpl out in therm ? ?? ? ? ?? ? + + + ? = (4) in terms of sparameters, il therm can be computed as follows: ) ( log 10 2 41 2 31 2 21 2 11 10 db s s s s il therm ?? ? ?? ? + + + ? ? = (5) the thermal resistance and power dissipated within the unit are then used to calculate the average tot al input power of the unit. the average total steady state input power (p in ) therefore is: ) ( 10 1 10 1 10 10 w r t p p therm therm il il dis in ? ?? ? ? ?? ? ? = ? ?? ? ? ?? ? ? = ? ? (6) where the temperature delta is the circuit temperat ure (t circ ) minus the mounting interface temperature (t mnt ): ) ( c t t t o mnt circ ? = (7) the maximum allowable circuit temperature is define d by the properties of the materials used to constr uct the unit. multiple material combinations and bonding techniqu es are used within the xinger iii product family to optimize rf performance. consequently the maximum allowable ci rcuit temperature varies. please note that the cir cuit temperature is not a function of the xinger case (t op surface) temperature. therefore, the case tempe rature cannot be used as a boundary condition for power handling calculations. due to the numerous board materials and mounting co nfigurations used in specific customer configuratio ns, it is the end users responsibility to ensure that the xinger iii coupler mounting interface temperature is maint ained within the limits defined on the power derating plots for the required average p ower handling. additionally appropriate solder composition is required to prevent reflow or fatigue failure at the rf ports. finally, reliabil ity is improved when the mounting interface and rf port temperatures are kep t to a minimum. the powerderating curve illustrates how changes in the mounting interface temperature result in conve rse changes of the power handling of the coupler.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c mounting in order for xinger surface mount couplers to work optimally, there must be 50 transmission lines lea ding to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensur e proper electrical performance. if either of these two conditions is not satisfied, electrical performance may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom gro und layers of the pcb. this minimizes ground inductanc e and improves ground continuity. all of the xinger h ybrid and directional couplers are constructed from ceram ic filled ptfe composites which possess excellent elec trical and mechanical stability having x and y thermal coefficient of expansion (cte) of 1725 ppm/ o c. when a surface mount hybrid coupler is mounted to a printed circuit board, the primary concerns are; en suring the rf pads of the device are in contact with the c ircuit trace of the pcb and insuring the ground plane of n either the component nor the pcb is in contact with the rf signal. mounting footprint coupler mounting process the process for assembling this component is a conventional surface mount process as shown in figu re 1. this process is conducive to both low and high v olume usage. figure 1: surface mounting process steps storage of components: the xinger iii products are available in either an immersion tin or tinlead fi nish. commonly used storage procedures used to control oxidation should be followed for these surface moun t components. the storage temperatures should be hel d between 15 o c and 60 o c. substrate: depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/c. this coeffic ient minimizes solder joint stresses due to similar expa nsion rates of most commonly used board substrates such a s rf35, ro4003, fr4, polyimide and g10 materials. mounting to hard substrates (alumina etc.) is pos sible depending upon operational temperature requirements . the solder surfaces of the coupler are all copper p lated with either an immersion tin or tinlead exterior f inish. solder paste: all conventional solder paste formulations will work well with anarens xinger iii surface mou nt components. solder paste can be applied with stenci ls or syringe dispensers. an example of a stenciled solde r paste deposit is shown in figure 2. as shown in th e figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part .
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c figure 2: solder paste application coupler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mount techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.104 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of todays conventional reflow methods. a low and high temperature thermal reflow profile are shown in fig ures 5 and 6, respectively. manual soldering of these comp onents can be done with conventional surface mount noncon tact hot air soldering tools. board preheating is highl y recommended for these selective hot air soldering methods. manual soldering with conventional irons should be avoided.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c figure 5 C low temperature solder reflow thermal pr ofile figure 6 C high temperature solder reflow thermal p rofile
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c qualification flow chart xinger iii product qualification visual inspection n=55 mechanical inspection n=50 solderability test n= 5 initial rf test n=50 visual inspection n=50 vtek testing n=45 visual inspection n=50 post v t ek test rf test n=50 visual inspection n=50 solder units to test board n=25 post solder visual inspection n=25 visual inspection n=25 rf test at 55c, 25c, 95c n=20 initial rf test board mounted n=25 visual inspection n=25 post resistance heat rf t est n=20 mechanical inspection n=20 voltage breakdown t est mil 202f, method 301 25c 5kv n=40 visual inspection n=50 c ontrol units rf test 25c only n=5 loose contr ol un its n= 5 resistance to solder mil 202g method 210f, condition k heat n=20 loose contr ol units n=5 control units n=5 loose control units n=5
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c contr ol u nits n=10 post voltage rf test n=50 therm al cycle 100 cycles 55 to 125c. dwell time= 30 min n=40 visual inspection n=50 control units n=10 visual inspection n=50 bake units for 1 hour at 100 to 120c n=40 125% power life test 72 hrs n= 3 post bake rf test n=50 visual inspection n=30 micr osection 3 test units 1 control f inal rf test @ 25c n= 2 5 microsection 2 life, 1 high power and 1 contr ol post moisture resistance rf test n=50 post t hermal rf test n=50 moisture resistance testing 25 to 65c for 2 hrs @ 90% humidity. soak for 168 hr s at 90% to 85% humidity. ramp temp to 25c in 2 hrs @ 90% humidity. then soak @ 10c for 3 hrs. n=40 post moisture resistance rf test n=50 control units n=10
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c application information the x3c09p103s is an x style 3db (hybrid) couple r. port configurations are defined in the table on page 2 of this data sheet and an example driving port 1 is shown b elow. ideal 3db coupler splitter operation 1 2 1v 0.707v ( 3db) 0.707v 90 ( 3db) isolated port 4 3 the hybrid coupler can also be used to combine two signals that are applied with equal amplitudes and phase quadrature (90o phase difference). an example of th is function is illustrated below. ideal 3db coupler combiner operation 1 2 1v 0.707v 0.707v 90 isolated port 4 3 3db couplers have applications in circuits which re quire splitting an applied signal into 2, 4, 8 and higher binary outputs. the couplers can also be used to combine m ultiple signals (inputs) at one output port. some s plitting and combining schemes are illustrated below:
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c 2-way splitter for doherty power amplifer hybrid coupler can be used in doherty power amplifi er to split the input power into the desired power ratio and phase delay. in above symmetrical doherty power amplifier (main and peaking amplifier delivers equ al amount output power at max drive condition), 3db hy brid splits the input power into 1:1 ratio with 90 degree phase difference. when the peaking amplifier is off, or when peaking amplifier is dramatically different than main ampli fier due to bias, matching, difference between transistors, the 3db hybrid coupler does not see equally unmatch ed termination, the mismatch is then reflected not onl y to isolated port, but also shows up at input port as return loss mismatch. 5db hybrid splits the input power into 1:2 ratio wi th 90 degree phase difference. it can be used in asymmetrical (1:2) doherty power amplifier architec ture as splitter. 5db hybrid is also used in some symmetrical doherty power amplifier to compensate t he gain difference between main and peaking amplifiers. it is worth noting that 3db and 5db hyb rid react differently to the termination mismatch, resulting in different return loss at input port. 2-way splitter/combiner network amplitude and phase tracking devices * 50 terminat ion * 50 termination output input
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c 4-way splitter/combiner network output * 50 termination * 50 termination input amplitude and phase tracking devices amplitude and phase tracking devices * 50 termination * 50 termination * 50 term. * 50 term. the splitter/combiner networks illustrated above us e only 3db (hybrid) couplers and are limited to bin ary divisions (2 n number of splits, where n is an integer). splitter/combiner circuits configu red this way are known as corporate networks. when a nonbinary number of divisions is required, a serial network must be used. serial n etworks can be designed with [3, 4, 5, .., n] splits, but have a practical limitation of about 8 splits. a 5db coupler is used in conjunction with a 3db cou pler to build 3way splitter/combiner networks. an ideal version of this network is illustrated below. note what is req uired; a 50% split (i.e. 3db coupler) and a 66% and 33% split (which is actually a 4.77db coupler, but due to losses in the system, higher coupler values, such as 5db, are ac tually better suited for this function). the design of this type of circuit requires special attention to the losses and phase lengths of the components and the interconnecting lines. a mor e in depth look at serial networks can be found in the article designing inline divider/combiner networks by dr . samir tozin, which describes the circuit design i n detail and can be found in the white papers section of the anaren website, www.anaren.com. 3-way splitter/combiner 1/3 pin 2/3 pin 1/3 pin 1/3 pin g=1 g=1 g=1 pout 2/3 pin pin 1/3 pin 1/3 pin 1/3 pin 5 db (4.77) coupler 3 db coupler 3 db coupler 5 db (4.77) coupler * 50 termination * 50 termination * 50 termination * 50 termination *recommended terminations power (watts) model 8 rfp 060120a15z502 10 rfp c10a50z4 16 rfp c16a50z4 20 rfp c20n50z4 50 rfp c50a50z4 100 rfp c100n50z4 200 rfp c200n50z4
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c reflections from equal unmatched terminations referring to the illustration below, consider the f ollowing reflection properties of the 3db coupler. a signal applied to port 1 is split and appears at the two output ports , ports 3 & 4, with equal amplitude and in phase qu adrature. if ports 3 & 4 are not perfectly matched to 50 there will b e some signal reflected back into the coupler. if t he magnitude and angle of these reflections are equal, there will be two signals that are equal in amplitude and in pha se quadrature (i.e. the reflected signals) being applied to ports 3 & 4 as inputs. these reflected signals will combine at the isolated port and will cancel at the input port. so, terminations with the same mismatch placed at the outputs of th e 3db coupler will not reflect back to the input port and therefore wi ll not affect input return loss. = 0 0 z z z z l l + ? 1 2 1v 0.707v ( 3db) 0.707v 90 ( 3db) isolated port 4 3 termination = z l 0.707v ? 90 0.707v ? | (0.5v 2 90 + 0.5v 2 90)| = || (0.5v 2 + 0.5v 2 180) = 0v termination = z l the reflection property of common mismatches in 3db couplers is very beneficial to the operation of ma ny networks. for instance, when splitter/combiner networks are e mployed to increase output power by paralleling tra nsistors with similar reflection coefficients, input return loss is not degraded by the match of the transistor circ uit. the reflections from the transistor circuits are directed away from the input to the termination at the isolated port of the coupler. this example is not limited to power amplifiers. in the case of low noise amplifiers (lnas), the refl ection property of 3db couplers is again beneficial. the transistor de vices used in lnas will present different reflecti on coefficients depending on the bias level. the bias level that yi elds the best noise performance does not also provi de the best match to 50 . a circuit that is optimized for both noise performance and return loss can be achieved by combining two matched lna transistor devices using 3db couple rs. the devices can be biased for the best noise pe rformance and the reflection property of the couplers will pr ovide a good match as described above. an example o f this circuit is illustrated below: lna circuit leveraging the reflection property of 3 db couplers amplitude and phase tracking lna devices biased for optimum noise performance 50 termination 50 termination output input energy reflected from lna devices biased for optimum noise performan ce
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c signal control circuits utilizing 3db couplers variable attenuators and phase shifter are two exam ples of signal control circuits that can be built u sing 3db couplers. both of these circuits also use the reflection prop erty of the 3db coupler as described above. in the variable attenuator circuit, the two output ports of a 3db coupler are terminated with pin diodes, which are basically a v oltage variable resistor at rf frequencies (consult the literature on pin diodes for a more complete equivalent circui t). by changing the resistance at the output ports of the 3db coupler, the reflection coefficient, , will also change and different amounts of energy will be reflected to the isolated port (note that the resistances must change together so that is the same for both output ports). a signal applied to the input o f the 3db coupler will appear at the isolated port and the amplitude of this signal will be a function of the resistance at the output ports. this circuit is illustrated belo w: variable attenuator circuit utilizing a 3db coupler vdc 1 2 input 0.707v ( 3db) 0.707v 90 ( 3db) output 4 3 0.707v ? 90 0.707v ? | (0.5v 2 90 + 0.5v 2 90)| = || and |output| = | | | input| pin diodes if =0, no energy is reflected from the pin diodes and s21 = 0 (input to output). if | | =1, all of the energy is reflected from the pin diodes and |s21| = 1 (assuming the ide al case of no loss). the ideal range for is C1 to 0 or 0 to 1, which translate to resistances of 0 to 50 and 50 to respectively. either range can be selected, althou gh normally 0 to 50 is easier to achieve in practice and produce s better results. many papers have been written on this circuit and should be consulted for the details of design and o peration. another very similar circuit is a variable phase sh ifter (illustrated below). the same theory is appli ed but instead of pin diodes (variable rf resistance), the coupler output s are terminated with varactors. the ideal varactor is a variable capacitor with the capacitance value changing as a function of the dc bias. ideally, the magnitude of the reflection coefficient is 1 for these devices at all bias leve ls. however, the angle of the reflected signal does change as the capacitance changes with bias level. so, ideally al l of the energy applied to port 1, in the circuit i llustrated below, will be reflected at the varactors and will sum at port 2 ( the isolated port of the coupler). however, the pha se angle of the signal will be variable with the dc bias level. in practic e, neither the varactors nor the coupler are ideal and both will have some losses. again, many papers have been written o n this circuit and should be consulted for the deta ils of design and operation.
usa/canada: toll free: europe: (315) 4328909 (800) 4116596 +44 2392232392 available on tape and reel for pick and place manufacturing. model x 3c21 p 1 - 03 s rev c variable phase shifter circuit utilizing a 3db coup ler 0.707v ? 90 vdc 1 2 input 0.707v ( 3db) 0.707v 90 ( 3db) output 4 3 0.707v ? * | (0.5v 2 90 + 0.5v 2 90)| =| | varactor diodes * the phase angle of the signal exiting port 2 will v ary with the phase angle of , which is the reflect ion angle from the varactor. the varactors must be matc hed so that their reflection coefficients are equal .
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 4328909 (800) 4116596 +44 2392232392 model x 3 c21 p 1 - 03 s rev c packaging and ordering information parts are available in a reel and as loose parts in a bag. packaging follows eia 4812 for reels . p arts are oriented in tape and reel as shown below. minimum order quantities are 2000 per reel and 100 for loos e parts.. see model numbers below for further ordering inform ation. xinger coupler frequency (mhz) size (inches) coupling value plating finish x3c 04 = 410500 07 = 600900 09 = 8001000 19 = 17002000 21 = 20002300 25 = 23002500 26 = 26502800 35 = 33003800 a = 0.56 x 0.35 b = 1.0 x 0.50 e = 0.56 x 0.20 l = 0.65 x 0.48 m= 0.40 x 0.20 p = 0.25 x 0.20 1 = 100 2 = 200 3 = 300 s = immersion tin xxx xx x x xx x 03 = 3db 05 = 5db 10 = 10db 20 = 20db 30 = 30db power (watts) example: x3c 19 p 1 03 s
mouser electronics authorized distributor click to view pricing, inventory, delivery & lifecycle information: anaren: ? x3c21p1-03s

▲Up To Search▲

Price & Availability of X3C04L1-05S

	To Download X3C04L1-05S Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .